Black Polyamide Hot Melt Adhesive
Black polyamide resin: polyamide hot melt adhesive UA-G182C is specialize designed for low pressure injection molding process. It’s as a viable solution for encapsulation and sealing in automotive, electrical and electronic industries.Such as tire pressure monitoring systems (TPMS), PCBs for seat occupant sensors, belt lock sensors, ECUs for motorcycles, air quality sensors, antennas for RF devices, smart entry (E-Key) systems, etc..
Topical Technical Date
Melting Point: 165-182°C
Viscosity: 5000-7000 mpas/210°C
Application: Low pressure molding （LPM）